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Signal Integrity Experts

Custom PCB Stack-up Design

Precision-engineered layer configurations for impedance matching, EMI control, and optimal signal integrity in high-speed and RF applications.

±5%
Impedance Tolerance
40+
Layer Configurations
20GHz
Frequency Support
24h
Stack-up Review
Our Capabilities

Advanced Stack-up Engineering

Expert-designed layer configurations that optimize electrical performance, manufacturability, and cost for your specific application requirements.

📐

Impedance Matching

Precision-controlled differential and single-ended impedance from 50Ω to 150Ω. ±5% tolerance with comprehensive TDR testing and validation.

🛡️

EMI/EMC Control

Strategic layer placement for electromagnetic interference reduction. Shielded stripline configurations and ground plane optimization.

Signal Integrity

Minimized crosstalk through careful trace spacing and layer sequencing. Optimized for high-speed digital signals up to 28 Gbps.

🔧

Custom Configurations

4-layer to 32-layer custom stack-ups. Mixed dielectric constructions for hybrid RF/digital designs and specialized applications.

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Simulation & Analysis

Pre-manufacturing signal integrity simulation using industry-standard tools. Predictive modeling for crosstalk, reflections, and losses.

Design Validation

Comprehensive DFM review with detailed stack-up documentation. Polar impedance testing and TDR analysis for every production lot.

Example Configuration

8-Layer HDI Stack-up

Typical high-speed digital stack-up with optimized layer arrangement for signal integrity and EMC performance.

Top Solder Mask0.5mil
L1: Top Signal1.2oz Cu
Prepreg 21164.0mil
L2: GND Plane1oz Cu
Core FR-48.0mil
L3: PWR Plane1oz Cu
Prepreg 21164.0mil
L4: Internal Signal0.5oz Cu
Prepreg 21164.0mil
L5: Internal Signal0.5oz Cu
Prepreg 21164.0mil
L6: PWR Plane1oz Cu
Core FR-48.0mil
L7: GND Plane1oz Cu
Prepreg 21164.0mil
L8: Bottom Signal1.2oz Cu
Bottom Solder Mask0.5mil
Signal Layer
Ground/Power
Core Material
Prepreg
Technical Specifications

Stack-up Capabilities

Parameter Standard Advanced High-Frequency
Layer Count 4-12 Layers 14-24 Layers 4-16 Layers
Impedance Tolerance ±10% ±5% ±5%
Min Trace Width 3mil / 75μm 2mil / 50μm 2mil / 50μm
Dielectric Materials FR-4, High-TG FR-4, Isola, Megtron Rogers, PTFE, Hybrid
Max Frequency 1 GHz 5 GHz 20+ GHz
Copper Weight 0.5-3 oz 0.5-4 oz 0.5-2 oz
Via Types Through-hole Blind/Buried, Microvia All Types + Stacked
Our Process

Stack-up Design Workflow

1

Requirements Analysis

Review your signal requirements, frequency range, and impedance specifications.

2

Layer Planning

Design optimal layer arrangement with proper reference planes and signal grouping.

3

Simulation

Perform signal integrity analysis and impedance calculations for all critical nets.

4

Documentation

Provide detailed stack-up drawing with material specs and manufacturing notes.

Need a Custom Stack-up Design?

Our engineers will analyze your requirements and deliver an optimized stack-up solution within 24 hours.

Get Free Stack-up Consultation →