From 1-layer to 32-layer complex multi-layer boards. Advanced HDI, blind & buried vias, and rigid-flex constructions with precision down to ±0.05mm.
State-of-the-art manufacturing facility with advanced equipment to deliver high-quality PCBs meeting international standards.
Full range from simple double-layer to complex 32-layer multi-layer boards. HDI technology, blind & buried vias, and microvia capabilities.
24-hour turnaround for prototypes. Fast delivery for time-critical projects without compromising on quality or precision.
±0.05mm impedance control. Laser drilling for microvias as small as 0.1mm. Fine-pitch BGA components down to 0.3mm.
100% electrical test (E-test), AOI inspection, IPC standards compliance. Full traceability from raw material to finished product.
Worldwide delivery with reliable logistics partners. Express shipping available to US, Europe, Asia, and worldwide.
FR-4, High-TG, Rogers, Isola, Megtron, PTFE, Polyimide (Flex), Metal Core (Aluminum). Professional material selection guidance.
Our engineers review your Gerber files for manufacturability and suggest optimizations.
Copper cladding, cutting to size, and CNC routing of panelized boards.
Drilling, plating, etching, solder mask application, and surface finish processing.
100% electrical test, visual inspection, and secure packaging for shipping.
We work with a wide range of base materials to meet your specific performance requirements.
Most common PCB material
High heat resistance
High-frequency RF
Low loss RF
High-performance
Ultra-fast digital
Microwave RF
Flexible circuits
Thermal management
Upload your Gerber files and get a comprehensive quote within 24 hours.
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