Combines rigid board sections with flexible circuits in one continuous piece. Eliminates connectors, reduces weight, and enables 3D packaging for aerospace, medical, and military applications.
Rigid-flex PCBs reduce weight by 60% and improve reliability by eliminating connectors. Topfast manufactures rigid-flex circuits from 4 to 22 layers with stacked micro-via technology.
MIL-PRF-31032 certified rigid-flex for avionics, satellite systems, and UAVs. Vibration and thermal shock resistant. Reduces weight critical in aerospace applications.
Implantable and wearable medical rigid-flex. Biocompatible materials, miniaturized designs for pacemakers, cochlear implants, and endoscopic cameras.
Smartphones, laptops, and tablets use rigid-flex for hinge connections, display routing, and battery interconnects. Cost-effective high-volume production.
ADAS modules, instrument clusters, and infotainment systems. IATF 16949 certified. Withstands -40°C to 150°C thermal cycling.
Flex layer fabrication
Sequential build-up
Mechanical + laser
Outline profiling
100% E-test
4 to 22 layers
1 to 6 layers
50μm / 50μm
0.1mm LID
0.5mm - 3.0mm
0.08mm - 0.3mm
-40°C to +150°C
MIL-PRF-31032, IPC 6013
Send your 3D design files and flex routing requirements. Our engineering team provides DFM feedback and stack-up optimization.
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