Surface mount technology assembly for components from 01005 to large BGA. High-speed pick and place, precision solder paste printing, and reflow soldering with AOI inspection.
Our SMT assembly line handles everything from ultra-small 01005 passives to large BGA packages with precision and reliability.
Siemens and Yamaha pick-and-place machines with 150,000 CPH speed. Dual-lane configuration for maximum throughput and efficiency.
DEK and GKG stencil printers with 2D/3D solder paste inspection. ±15μm placement accuracy for fine-pitch and micro-BGA applications.
10-zone reflow ovens with nitrogen atmosphere. Precise temperature profiling for leaded and lead-free processes, max 300°C capability.
Automated optical inspection after reflow with 100% coverage. Defect detection for missing components, polarity, solder bridges, and tombstones.
Stencil printing
Paste inspection
Component mounting
Thermal profile
Quality inspection
Comprehensive surface mount assembly capabilities for all component types and package sizes.
01005 to 50×50mm
0.3mm minimum
±15μm @ 3σ
150,000 CPH
10 heating zones
±2μm height
Class 2 & 3
RoHS compliant
Send your BOM and Gerber files. Get a detailed SMT assembly quote within 24 hours.
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