SMT, through-hole, and mixed technology assembly. From prototype to mass production with precise component placement and reliable solder joints.
Full-service PCB assembly with state-of-the-art SMT lines and through-hole capabilities.
Surface mount technology for 01005, 0201, 0402, 0603 components. Fine-pitch BGA, QFN, and LGA packages with precision placement.
Traditional through-hole assembly for connectors, capacitors, and heavy components. Both wave soldering and selective soldering.
Combination of SMT and through-hole on the same board. Complex hybrid assemblies with optimal cost and reliability.
Advanced placement of 0.3mm BGA, 0.4mm pitch QFN, and CSP components with optical inspection.
AOI inspection, X-ray for BGA/QFN, ICT testing, functional testing. IPC-A-610 Class 2/3 compliance.
Complete product assembly including cable harness, final testing, and packaging services.
Precision stencil printing
Automated SMT placement
Controlled oven profile
AOI and X-ray
ICT or functional test
Wide range of assembly capabilities to meet your project requirements.
01005 to BGA
Axial & Radial
0.3mm pitch
Rigid-Flex
Power LED
Connectors
Coating
BGA protection
Send us your Gerber files, BOM, and pick-and-place file. Get a quote within 24 hours.
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