Industry-leading 0.3mm pitch BGA placement with X-ray inspection, underfill encapsulation, and precision rework capabilities for advanced semiconductor packaging.
From 0.8mm to 0.3mm pitch BGA packages, our advanced assembly lines deliver precision placement with comprehensive inspection and reliability testing.
Industry-minimum 0.3mm pitch BGA placement with precision alignment system. Supports high-density applications like mobile SoCs, GPUs, and networking chips.
100% X-ray inspection for all BGA and QFN assemblies. Detect bridging, voiding, and solder joint integrity issues before they reach your customers.
Automatic underfill dispensing for BGA stress relief. Thermal cycling reliability improved by 5x compared to non-underfilled assemblies.
In-house BGA rework capability with precision hot air and IR reflow. Replace individual BGA chips without disturbing surrounding components.
0.4mm and 0.5mm pitch QFN/DFN with bottom-side thermal pad soldering. Void-free reflow profiles for optimal thermal performance.
IPC-A-610 Class 3 compliant. Thermal cycling, drop test, and vibration testing available. DFM reports for every BGA assembly.
Comprehensive support for all common fine-pitch package types and pitches.
Pad design & solderability check
Laser-cut stencil with fine aperture
±20μm placement with vision align
100% BGA solder joint check
Optional underfill + ICT/flying probe
0.3mm pitch & up
0.4mm pitch
0.35mm+ pitch
Wafer-level CSP
2D / 3D inspection
Automatic dispense
BGA replacement
Bed-of-nails test
Share your Gerber files, BOM, and component datasheets. Our engineering team will provide a DFM review and competitive quote for your fine-pitch assembly project.
Get a Free Quote →