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Real-world PCB fabrication and PCBA assembly success stories from Topfast Electronic.

12-Layer HDI PCB for Medical Device Manufacturer

Industry: MedicalLayers: 12Turnaround: 12 days

A leading medical device company needed ultra-reliable HDI PCBs for their diagnostic imaging equipment. Topfast delivered 12-layer boards with microvias and impedance control.

Challenge

  • Minimum trace width: 3mil with ±10% impedance control
  • IPC Class 3 compliance required
  • Tight via-to-via spacing for high density

Solution

  • Sequential lamination with controlled depth drilling
  • Impedance test coupons on every panel
  • Automatic optical inspection (AOI) for all layers

Result

100% yield on first article. Customer expanded order to 5,000 panels monthly.

Automotive ECU with Heavy Copper and IMS

Industry: AutomotiveLayers: 6Turnaround: 8 days

Electric vehicle powertrain controller required thermal management with 4oz heavy copper on IMS substrate.

Challenge

  • 4oz copper weight for high current
  • IMS (Insulated Metal Substrate) for heat dissipation
  • Thermal cycling test: -40°C to +150°C

Solution

  • Direct bonded copper (DBC) on aluminum base
  • Thermal vias with filled resin
  • Extended thermal profile testing

Result

All boards passed thermal cycling. Customer qualified Topfast as Tier 1 supplier.

Flexible PCB for Wearable IoT Device

Industry: IoT/WearablesLayers: 4Turnaround: 5 days

Startup needed quick-turn flexible PCBs for smartwatch prototype validation.

Challenge

  • Ultra-thin 0.1mm polyimide
  • Stiffener required at connector areas
  • 1000pcs for prototype run

Solution

  • Additive flexible stack-up
  • PI stiffener at SMT areas
  • Quick-turn assembly with consignment kit

Result

Validated prototype in 5 days. Product went to mass production with Topfast.

High-Frequency Radar PCB for 77GHz Application

Industry: Automotive RadarLayers: 8Turnaround: 15 days

77GHz automotive radar module required Rogers material with precise dielectric constant.

Challenge

  • Dk tolerance: ±0.04 at 77GHz
  • Rogers RT/duroid 5880 material
  • Blind vias to layer 3

Solution

  • Controlled impedance on all RF traces
  • Laser drilling for blind microvias
  • RF testing with vector network analyzer

Result

Insertion loss < 0.5dB at 77GHz. Full production order placed.

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