Ultra-precision 01005 component placement. Our high-speed SMT lines handle the world's smallest passive components with ±25μm placement accuracy for next-generation electronics.
From 01005 to BGA, we handle the full spectrum of modern SMT components with precision placement and rigorous quality control.
Industry-leading 01005 (0402 metric) ultra-miniature passive placement. Perfect for space-constrained consumer electronics, wearables, and IoT devices.
High-volume placement of 0201 and 0402 resistors and capacitors. Optimized paste printing and reflow profiles ensure zero tombstoning defects.
Advanced AOI with fiducial recognition and component inspection. Automatic detection of missing, offset, or reversed components.
12-zone nitrogen reflow ovens with precise temperature profiling. Tailored profiles for lead-free and leaded solder processes.
Laser-cut stainless steel stencils with nano-coating for superior paste release. APC (Area Ratio > 0.66) optimized for 01005 pads.
Full ESD-protected assembly lines. Class 1000 cleanroom environment for moisture-sensitive component handling and storage.
From ultra-miniature 01005 passives to large QFP packages — our lines handle the complete size range.
Nano-coated laser stencil for 01005 pads
Solder paste inspection (SPI) before placement
±25μm accuracy placement head
Automated optical & X-ray inspection
12-zone nitrogen reflow oven
Ultra-miniature passives
Fine pitch packages
Array packages
Mini & power LED
FPC / board-to-board
Terminal blocks
BGA protection
IPC CC-830 compliant
Upload your Gerber files, BOM, and pick-and-place file. Our engineering team will review and provide a detailed quote within 24 hours.
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